Properties
- High thermal conductivity
- Electrical insulation
- Good mechanical strength
Applications
- Electronics Industry
PHYSICAL AND MECHANICAL PROPERTIES
| Densification rate | 97% | |
| Density | 3.22 g/cm3 | |
| Grain sizeafter sintering | < 5 µm | |
| 4-pt bendingstrength | 270 MPa | |
| TheoricalYoung modulus | 368 GPa | |
| Thermalproperties from -50°C to 60 °C | ||
| Thermalconductivity at RT | 163.1 W/m.K | |
| Thermal expansion coefficient | at -50 °C | 1.84 *10^-6 K^-1 |
| at 20 °C | 2.89 *10^-6 K^-1 | |
| at 60°C | 3.38 *10^-6 K^-1 | |
