Properties
- High thermal conductivity
- Electrical insulation
- Good mechanical strength
Applications
- Electronics Industry
PHYSICAL AND MECHANICAL PROPERTIES
Densification rate | 97% | |
Density | 3.22 g/cm3 | |
Grain sizeafter sintering | < 5 µm | |
4-pt bendingstrength | 270 MPa | |
TheoricalYoung modulus | 368 GPa | |
Thermalproperties from -50°C to 60 °C | ||
Thermalconductivity at RT | 163.1 W/m.K | |
Thermal expansion coefficient | at -50 °C | 1.84 *10^-6 K^-1 |
at 20 °C | 2.89 *10^-6 K^-1 | |
at 60°C | 3.38 *10^-6 K^-1 |