In stock
- Solids loading + debind/sinter guidance in every order
- Mutual NDA before any file or spec review
Aluminium Nitride 3D Printing Paste
Print aluminium nitride (AlN) parts on 3DCeram's Ceramaker laser-SLA platform, then debind and sinter to a ceramic that conducts heat yet insulates electrically.
- ✓ 163 W/m·K thermal conductivity with electrical insulation — power-electronics substrates
- ✓ Print conformal cooling and channelled geometries not possible by pressing
- ✓ Ceramic SLA paste for the 3DCeram Ceramaker platform — quote-based, mutual NDA before spec review
What your process engineer actually checks
Functional thermal data
163.1 W/m·K thermal conductivity with electrical insulation and 368 GPa modulus — the property set that makes AlN a power-electronics ceramic, backed by datasheet numbers.
The full ceramic workflow
Every order ships with the debinding and sintering parameters. AlN is sintered to 97% density, and shrinkage is compensated in build prep so conformal cooling geometries land on dimension.
A materials engineer on the line
Non-oxide sintering, solids loading and shrinkage are unforgiving. Talk to an engineer who runs this paste — sub-4h reply, NDA standard.
Aluminium Nitride 3D Printing Paste is a 3DCeram aluminium nitride (AlN) paste for the Ceramaker laser-SLA platform — a non-oxide ceramic that combines very high thermal conductivity with electrical insulation.
Why engineers choose this paste
The go-to ceramic for power electronics: it conducts heat like a metal but insulates like a ceramic.
163 W/m·K thermal conductivity
Moves heat far better than alumina while staying an electrical insulator — ideal for power-electronics substrates.
Electrical insulation
High resistivity for insulating heat-spreader and substrate roles in electronics.
368 GPa modulus
High stiffness and good mechanical strength at 3.22 g/cc density.
Complex SLA geometry
Print channelled and conformal cooling geometries not practical by pressing.
Print → debind → sinter
Ceramic stereolithography on the 3DCeram Ceramaker platform. The green part is larger than the finished part — shrinkage is compensated in build preparation.
Laser SLA print
The ceramic-loaded paste is cured layer-by-layer on a 3DCeram Ceramaker laser-SLA machine into a green part.
Debinding
The organic binder is removed in a controlled thermal cycle, leaving a fragile ceramic-only brown part.
Sintering
Sintered to 97% dense AlN (3.22 g/cc, <5 µm grain) preserving high thermal conductivity.
Typical applications
Thermal-management and insulating parts for electronics.
Aluminium Nitride — physical & mechanical properties
Representative post-sinter values from the 3DCeram material datasheet. Final numbers depend on part geometry and your qualified sinter cycle.
| Property | Value |
|---|---|
| Densification rate | 97% |
| Density | 3.22 g/cm³ |
| Grain size after sintering | <5 µm |
| 4-pt bending strength | 270 MPa |
| Young’s modulus (theoretical) | 368 GPa |
| Thermal conductivity (RT) | 163.1 W/m·K |
| CTE (20 °C) | 2.89 ×10⁻⁶ K⁻¹ |
| Brand | 3DCeram |
| Weight | 5 kg |
| Country of origin | France |
| Printing Materials | Ceramic Pastes |
| Technology | CERAMIC SLA |
| Material | Aluminium Nitride (AlN) |
| Application | Engineering, Jigs & Fixtures, Manufacturing |
We formulate and qualify. Custom variants on request.
Need a specific ceramic chemistry, solids loading, or a tuned binder for your process? Our materials team formulates and verifies rheology and sinter behavior before you commit. Typical lead 3–4 weeks.
Complete the workflow
Common questions
Don't see yours? Email [email protected] — NDA standard, typical reply within 4 hours.
What is Aluminium Nitride paste and why is it special?
How does AlN compare with alumina for electronics?
Why does the printed part shrink during processing?
Can I print conformal cooling or channelled geometries?
Which printer runs this paste?
Can I order a sample first?
Place your order, or talk to an engineer first
Order Aluminium Nitride 3D Printing Paste direct, or talk to materials engineer