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With every system
- Install + operator training plus starter compound
- Validated removal recipes set and tested at handover
Other Equipment, Post-Processing Equipment, Support Removal · Support removal
AM Solutions C1 — Automated Support & Resin Removal System (Benchtop)
Benchtop automated system that removes support structures and cleans uncured resin from delicate photopolymer 3D-printed parts — a compound dip process with no IPA or critical solvents.
- ✓ Automated support removal + cleaning for SLA / DLP / PolyJet parts
- ✓ IPA-free compound · 230 V plug-and-play benchtop
- ✓ Lead time: 5–8 weeks — built to order · install + training included
$31,970
Price held 7 days after order.
Install + training included
Tailored service plan
What your process engineer actually checks
What your process engineer actually checks
Automated, gentle, IPA-free
A temperature-controlled compound dip combines chemical, thermal and mechanical action to loosen and remove supports and lift uncured resin — without IPA or critical solvents. Consistent, gentle removal from intricate geometries that hand-cleaning tends to damage, on a benchtop that plugs into a standard 230 V outlet.
An applications engineer on the line
Not a ticket queue. We run AM post-processing in-house, so recipe, compound and workflow advice comes from the floor. Sub-4h reply, NDA standard.
340 × 440 × 170 mm
Processing space (13.4 × 17.3 × 6.7 in)
62.5 L
Fill volume
IPA-free
Compound dip process
230 V
Benchtop plug-and-play
Data logger
Contamination + cycle tracking
About this product
The AM Solutions C1 is a benchtop system that automatically removes support structures and cleans uncured resin from delicate photopolymer 3D-printed parts. A temperature-controlled compound dip loosens supports and lifts resin — no IPA, no critical solvents — replacing manual scrubbing with a consistent, hands-off cycle.
Why resin labs run the C1
Automated support removal and cleaning, IPA-free, on the bench.
Automated, gentle, IPA-free
A temperature-controlled compound dip combines chemical, thermal and mechanical action to remove supports and lift uncured resin — no IPA, no critical solvents. Consistent, gentle removal from intricate geometries.
Benchtop, plug-and-play
Plugs into a standard 230 V outlet with a compressed-air connection — no special infrastructure. Sized for a lab or finishing bench, it moves on a stacker or rollers.
Gentle on fine features
Because supports loosen chemically and thermally rather than by force, the C1 clears intricate geometries that manual picking chips or breaks. A skimming and overflow screen carries off gelatinous support material.
Traceable and monitored
A contamination sensor and data logger record temperature, cycle times and contamination for each load, and automatic dosing keeps the compound in spec — repeatable results with a documented record.
How the C1 processes a load
Load, run the compound cycle, unload clean, de-supported parts.
Step 01
Load parts in the basket
Place the photopolymer parts into the basket and select the stored recipe for the resin and geometry.
Step 02
Compound dip cycle
The basket is dipped into the temperature-controlled compound, where chemical, thermal and mechanical action loosen supports and lift uncured resin.
Step 03
Skim, replenish, unload
A skimming screen removes gelatinous support material and automatic dosing tops up the compound; unload clean parts with supports ready to lift off.
Where the C1 fits
Resin labs and shops cleaning and de-supporting small to medium parts.
SLA parts
Clean + de-support in one cycle
DLP parts
Consistent resin removal
PolyJet parts
Photopolymer cleaning
Support-heavy geometry
Gentle on fine features
Dental & jewelry
Small, intricate parts
Engineering prototypes
Repeatable, documented cycles
Key specifications
- Process: automated compound dip — support and resin removal, IPA-free
- Processing space: 13.4 × 17.3 × 6.7 in / 340 × 440 × 170 mm (min part ~20 × 20 × 20 mm)
- Fill volume: 62.5 L · dosing reservoir: 25 L (automatic)
- Compound: RAM-D1 / RAM-D1M / RAM-D1R / RAM-D1C
- Power: 230 V benchtop · compressed air: G1″ @ 7 bar · controls: 24 V DC
- Traceability: contamination sensor + data logger · origin: Germany (Rösler)
See the Specifications tab for the full datasheet.
Not sure the C1 is the right unit?
Match the system to your part size and volume.
Tell us your printer, resins and part sizes — an applications engineer will confirm whether the C1 fits your parts or whether the larger C1 Max is the better call. We run AM post-processing ourselves, so the recommendation comes from the floor, not a catalog. Sub-4h reply, NDA standard.
Why source the C1 through Additive Plus
- Install and operator training included, with starter compound
- Compound, spares and service through one US point of contact
- Application support from a team that runs AM post-processing in-house
- <24h response · 200+ AM systems delivered across 23 countries
| Brand | AM Solutions, Rösler |
| Technology | Support removal |
| Country of origin | Germany |
| Dimensions of the processing space | 340 x 440 x 170 mm, 13.4 x 17.3 x 6.7 in |
| Fill volume | 62.5 liters |
| Subsequent dosing | 25 Liter |
| Recommended compound | RAM-D1; RAM-D1M, RAM-D1R, RAM-D1C |
| Transport | stacker, movable by rollers |
| Compressed air connection | G1’’ 7 bars |
| Control voltage | 24 V DC |
See your supports come off clean
Send us a batch of your SLA, DLP or PolyJet parts and we will remove supports and clean them on the C1 in California, IPA-free — you inspect the result before you commit to a system.
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Fully automated continuous blasting line that cleans and surface-finishes whole powder-bed print jobs in 24/7 operation — load a full build, walk away.
- ✓ Continuous 24/7 depowdering + surface finishing, hands-free
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· Lead time: 8–14 weeks — built & configured to order. Install, line integration and training included.From teams running AM Solutions post-processing
Unedited feedback from production and R&D leads.
★★★★★
Support removal used to chip our fine SLA features. The C1 loosens supports so they come off clean, and it is off IPA.
MK
Marta Kellner Process Engineer · Medical devices
★★★★★
Benchtop, plugs into a normal outlet, and the data logger gives us a record for each load. Easy to bring into the lab.
DO
Dan Okafor Lab Manager · Industrial manufacturing
★★★★★
Consistent cleaning without solvents. Our operators spend far less time picking supports by hand now.
YS
Yuki Sato AM Engineer · Consumer products
Common questions
Don't see yours? Email [email protected] — NDA standard, typical reply within 4 hours.
What does the C1 do?
The AM Solutions C1 is a benchtop system that automatically removes support structures and cleans uncured resin from photopolymer 3D-printed parts. Parts sit in a basket that is dipped into a temperature-controlled compound, where chemical, thermal and mechanical action loosen supports and lift resin. It replaces manual scrubbing and picking with a consistent, hands-off cycle.
Does the C1 use IPA or solvents?
No. The C1 uses AM Solutions RAM-D1 compound rather than IPA or critical solvents, so handling is simpler and EHS requirements are lower than a solvent bath. The process still removes supports and cleans resin effectively, and the benchtop unit plugs into a standard 230 V outlet.
Which resins and printers is the C1 for?
The C1 is built for photopolymer parts from SLA, DLP and PolyJet printers. Its 340 × 440 × 170 mm processing space suits small and medium parts, with a minimum part around 20 × 20 × 20 mm. For large-format SLA parts and build platforms, Additive Plus offers the larger C1 Max. An engineer can confirm the right unit for your work.
How gentle is support removal on fine features?
Because the compound loosens supports chemically and thermally rather than by force, the C1 removes support material and resin consistently from intricate geometries that manual picking often chips or breaks. An integrated skimming and overflow screen carries off the gelatinous support material during the cycle.
Is the process traceable?
Yes. The C1 includes a contamination (saturation) sensor and a data logger that records temperature, cycle times and contamination level, so you have a record of how each load was processed. Automatic media replenishment keeps the compound in spec batch to batch for repeatable results.
What compound and consumables does it use?
The C1 runs AM Solutions RAM-D1 compound and its variants (RAM-D1M, RAM-D1R, RAM-D1C), with a 62.5 L fill volume and a 25 L dosing reservoir for automatic replenishment. Additive Plus supplies the compound with the system and handles reorders through one US point of contact.
What does the C1 need to run?
The C1 is a benchtop unit that connects to a standard 230 V outlet with 24 V DC controls, plus a compressed-air connection at G1″ and 7 bar. It moves on a stacker or rollers. That makes it straightforward to set up in a lab or on a finishing bench without special infrastructure.
What is the lead time and what is included?
The C1 is built to order, typically 5–8 weeks. Additive Plus includes install and operator training plus starter compound, with spares and service through a single US point of contact — so your team runs consistent support removal and cleaning from handover.
Place your order, or talk to an engineer first
Order AM Solutions C1 — Automated Support & Resin Removal System (Benchtop) direct, or talk to materials engineer