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Other Equipment, Post-Processing Equipment, Support Removal · Support removal
C1 Support Removal System
Automated system for gentle, reliable support and resin removal from delicate 3D printed polymer components.
$24,900
Lot # and price held 7 days after order.
NDA standard
Ships in 1–2 business days
Spec-match guarantee on every lot
Built for production teams
What your process engineer actually checks
Locked, traceable lot chemistry
Every lot ships with a COA documenting PSD, sphericity, flow rate, apparent density, and full chemistry — and a lot number you can trace. Aerospace and medical teams reorder 4+ times without re-qualifying.
Qualified parameters, not just powder
Validated parameter sets for EOS M 290, Renishaw 500Q, SLM 280, and our own AO Metal LPBF ship with the order. Load the profile and hit density on the first build — no parameter-development burn.
A materials engineer on the line
Questions on ferrite content, flowability, recyclate ratios, or HIP response? A materials engineer answers directly — not a contact-form bot. Most replies in under 4 hours, NDA standard.
About this product
Tired of damaging delicate parts during support removal? The C1 system delivers fully automated, precise removal of support structures and resin from 3D printed polymer components—without compromising intricate details or part integrity. Ideal for precision functional parts, complex prototypes, and design objects with fine features.
Using a patented combination of chemical, thermal, and mechanical actions, the C1 gently yet effectively cleans even the most complex geometries. With programmable recipes, continuous process monitoring, and automated media management, it guarantees consistent, repeatable results while reducing labor costs and eliminating manual errors.
Support Removal
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Polymers
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Key Features & Benefits
- Gentle Yet Effective: Perfectly balanced chemical, thermal, and mechanical action removes supports without damaging delicate part structures.
- Full Automation: Load the basket, select the recipe, and let the C1 handle the rest—dramatically reducing labor time and skill requirements.
- Process Control & Traceability: Continuous monitoring of temperature, cycle time, and media saturation ensures consistent quality. All data is logged for full traceability.
- Cost-Efficient Operation: Automated media replenishment and saturation monitoring minimize compound consumption and waste.
- Plug-and-Play Simplicity: Easy to install and operate, with pre-loaded programs and an intuitive PLC controller.
- Safe & Clean: Built-in grate, drip edge, and removable screen ensure a clean, safe working environment.
FAQs
What 3D printing technologies is the C1 compatible with?
The C1 is specifically designed for photopolymer-based technologies such as Polyjet and SLA. It effectively removes the support materials and resins used in these processes.
How does the C1 avoid damaging delicate parts?
The process relies on a carefully calibrated interplay of chemical, thermal, and gentle mechanical effects. This synergy dissolves and dislodges support material without applying excessive force that could break fine part features.
Can I create custom cleaning programs for different parts?
Yes. While the system comes with standard processing recipes, the special software package allows you to program, modify, and save custom process sequences tailored to specific part geometries and materials.
How does the system manage the processing compound?
The C1 features an automatic level sensor and replenishment system to maintain the optimal compound volume. An integrated saturation sensor monitors the compound’s condition, ensuring consistent cleaning performance and minimizing waste.
What are the dimensions of the processing basket?
The processing space measures 340 mm (W) x 440 mm (D) x 170 mm (H), suitable for a wide range of part sizes, from small detailed components to larger prototypes.
Is the process safe and clean?
Absolutely. The system includes a built-in grate with a drip edge and a removable screen for easy cleaning, containing the process and preventing spills, which ensures a safe and tidy workspace.
What kind of data logging and monitoring does the C1 offer?
Key parameters like temperature, cycle times, and the degree of compound saturation are continuously recorded by a data logger. This provides full traceability for quality control and ensures result consistency.
How is the C1 different from manual or ultrasonic cleaning?
Unlike manual methods (risk of breakage) or ultrasonic cleaning (which can be too aggressive), the C1 offers a controlled, gentle, and hands-off automated process. This guarantees higher throughput, perfect reproducibility, and no part damage
The C1 is specifically designed for photopolymer-based technologies such as Polyjet and SLA. It effectively removes the support materials and resins used in these processes.
The process relies on a carefully calibrated interplay of chemical, thermal, and gentle mechanical effects. This synergy dissolves and dislodges support material without applying excessive force that could break fine part features.
Yes. While the system comes with standard processing recipes, the special software package allows you to program, modify, and save custom process sequences tailored to specific part geometries and materials.
The C1 features an automatic level sensor and replenishment system to maintain the optimal compound volume. An integrated saturation sensor monitors the compound’s condition, ensuring consistent cleaning performance and minimizing waste.
The processing space measures 340 mm (W) x 440 mm (D) x 170 mm (H), suitable for a wide range of part sizes, from small detailed components to larger prototypes.
Absolutely. The system includes a built-in grate with a drip edge and a removable screen for easy cleaning, containing the process and preventing spills, which ensures a safe and tidy workspace.
Key parameters like temperature, cycle times, and the degree of compound saturation are continuously recorded by a data logger. This provides full traceability for quality control and ensures result consistency.
Unlike manual methods (risk of breakage) or ultrasonic cleaning (which can be too aggressive), the C1 offers a controlled, gentle, and hands-off automated process. This guarantees higher throughput, perfect reproducibility, and no part damage
| Brand | AM Solutions, Rösler |
| Technology | Support removal |
| Country of origin | Germany |
| Dimensions of the processing space | 340 x 440 x 170 mm, 13.4 x 17.3 x 6.7 in |
| Fill volume | 62.5 liters |
| Subsequent dosing | 25 Liter |
| Recommended compound | RAM-D1; RAM-D1M, RAM-D1R, RAM-D1C |
| Transport | stacker, movable by rollers |
| Compressed air connection | G1’’ 7 bars |
| Control voltage | 24 V DC |
Full documentation — TDS, SDS, batch COA, and parameter sets for the major LPBF platforms. Everything you need for qualification under AS9100 / ISO 13485 workflows.
Don't see your spec?
We atomize our own. Custom variants on request.
Tighter PSD, modified chemistry, custom blend? Our ATO atomization lab runs custom batches in 3–4 weeks. Biocompatible, refractory, proprietary — all in-house, verified before ship.
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From process engineers running C1 Support Removal System
Unedited feedback from customers who reorder C1 Support Removal System.
★★★★★
Same lot 4 times in a row. We stopped re-running parameter sweeps after the second order — density was identical to the first build.
MK
Marcus K.
Process Engineer · Aerospace OEM
★★★★★
Asked about ferrite content on a Friday. A materials engineer answered Monday morning with actual data, not a sales pitch. That's why we keep ordering.
PS
Priya S.
R&D Lead · Medical Devices
★★★★★
COA matches the bottle. PSD and flow are exactly what was on the sheet — we run it on a Renishaw 500Q and it hits density on the first try.
DR
Diego R.
Production Lead · Energy
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