Made to order
- Install + operator training plus starter compound
- Validated removal recipes set and tested at handover
AM Solutions C1 — Automated Support & Resin Removal System (Benchtop)
Benchtop automated system that removes support structures and cleans uncured resin from delicate photopolymer 3D-printed parts — a compound dip process with no IPA or critical solvents.
- ✓ Automated support removal + cleaning for SLA / DLP / PolyJet parts
- ✓ IPA-free compound · 230 V plug-and-play benchtop
- ✓ Lead time: 5–8 weeks — built to order · install + training included
$31,970
What your process engineer actually checks
Automated, gentle, IPA-free
A temperature-controlled compound dip combines chemical, thermal and mechanical action to loosen and remove supports and lift uncured resin — without IPA or critical solvents. Consistent, gentle removal from intricate geometries that hand-cleaning tends to damage, on a benchtop that plugs into a standard 230 V outlet.
An applications engineer on the line
Not a ticket queue. We run AM post-processing in-house, so recipe, compound and workflow advice comes from the floor. Sub-4h reply, NDA standard.
The AM Solutions C1 is a benchtop system that automatically removes support structures and cleans uncured resin from delicate photopolymer 3D-printed parts. A temperature-controlled compound dip loosens supports and lifts resin — no IPA, no critical solvents — replacing manual scrubbing with a consistent, hands-off cycle.
Support removal
PolymersManual support removal is where the margin leaks
Done by hand, removing supports and cleaning resin can reach up to 50% of a finished part’s cost — and results vary part to part, which blocks reproducible series production. The C1 moves that step into an automated, monitored cycle: load the basket, run the recipe, and get clean, repeatable parts with far less operator time.
A dental lab paired the C1 with its resin dental printer to run a stable, industrial print-and-clean workflow — automated support and resin removal with reproducible results (for example, ASA parts cleaned in about 1.5 hours), freeing technicians from manual finishing.
Why resin labs run the C1
Automated support removal and cleaning, IPA-free, on the bench.
Automated, gentle, IPA-free
A temperature-controlled compound dip combines chemical, thermal and mechanical action to remove supports and lift uncured resin — no IPA, no critical solvents. Consistent, gentle removal from intricate geometries.
Benchtop, plug-and-play
Plugs into a standard 230 V outlet with a compressed-air connection — no special infrastructure. Sized for a lab or finishing bench, it moves on a stacker or rollers.
Gentle on fine features
Because supports loosen chemically and thermally rather than by force, the C1 clears intricate geometries that manual picking chips or breaks. A skimming and overflow screen carries off gelatinous support material.
Traceable and monitored
A contamination sensor and data logger record temperature, cycle times and contamination for each load, and automatic dosing keeps the compound in spec — repeatable results with a documented record.
How the C1 processes a load
Load, run the compound cycle, unload clean, de-supported parts.
Load parts in the basket
Place the photopolymer parts into the basket and select the stored recipe for the resin and geometry.
Compound dip cycle
The basket is dipped into the temperature-controlled compound, where chemical, thermal and mechanical action loosen supports and lift uncured resin.
Skim, replenish, unload
A skimming screen removes gelatinous support material and automatic dosing tops up the compound; unload clean parts with supports ready to lift off.
- Stainless cabinet and removable work basket for continuous industrial operation and easy cleaning
- Fine sieve separates and carries off removed support material
- Automatic media monitoring and refilling keeps the process in spec, hands-off
- Contamination sensor and data logger record temperature, cycle time and contamination per load
- Plug-and-play PLC control with stored recipes
Where the C1 fits
Resin labs and shops cleaning and de-supporting small to medium parts.
Sample applications
Key specifications
- Process: automated compound dip — support and resin removal, IPA-free
- Processing space: 13.4 × 17.3 × 6.7 in / 340 × 440 × 170 mm (min part ~20 × 20 × 20 mm)
- Fill volume: 62.5 L · dosing reservoir: 25 L (automatic)
- Compound: RAM-D1 / RAM-D1M / RAM-D1R / RAM-D1C
- Power: 230 V benchtop · compressed air: G1″ @ 7 bar · controls: 24 V DC
- Traceability: contamination sensor + data logger · origin: Germany (Rösler)
See the Specifications tab for the full datasheet.
Not sure the C1 is the right unit?
Match the system to your part size and volume.
Why source the C1 through Additive Plus
- Backed by the Rösler Group — 90+ years in mass finishing and 15,000+ media and compounds developed in-house
- Install and operator training included, with starter compound
- Compound, spares and service through one US point of contact
- Application support from a team that runs AM post-processing in-house
- <24h response · 200+ AM systems delivered across 23 countries
| Brand | AM Solutions, Rösler |
| Technology | Support removal |
| Country of origin | Germany |
| Dimensions of the processing space | 340 x 440 x 170 mm, 13.4 x 17.3 x 6.7 in |
| Fill volume | 62.5 liters |
| Subsequent dosing | 25 Liter |
| Recommended compound | RAM-D1; RAM-D1M, RAM-D1R, RAM-D1C |
| Transport | stacker, movable by rollers |
| Compressed air connection | G1’’ 7 bars |
| Control voltage | 24 V DC |
Product videos
Send us a batch of your SLA, DLP or PolyJet parts and we will remove supports and clean them on the C1 in California, IPA-free — you inspect the result before you commit to a system.
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Freight and installation requirements confirmed with you before the order is placed.
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- ✓ Fully automatic multi-mode with ejector molds — ~60 s cycle; manual single-mode with the included test mold
- ✓ Runs on a standard 115 V (US) or 230 V (EU) outlet — 250 lb benchtop footprint, mold swap in ~15 min
- ✓ Lead time: ships in about 1 week — made in Cincinnati, OH, with US-based support
In stock
· About 1 weekCommon questions
Don't see yours? Email [email protected] — NDA standard, typical reply within 4 hours.
What does the C1 do?
Does the C1 use IPA or solvents?
Which resins and printers is the C1 for?
How gentle is support removal on fine features?
Is the process traceable?
What compound and consumables does it use?
What does the C1 need to run?
What is the lead time and what is included?
Place your order, or talk to an engineer first
Order AM Solutions C1 — Automated Support & Resin Removal System (Benchtop) direct, or talk to materials engineer