Engineering

Cost-effective rigid general-purpose photopolymer for the Nexa3D XiP and XiP Pro — accurate models, functional prototypes and jigs in a clean matte white.

• ✓ Rigid, ABS-like: 40 MPa tensile, 95 MPa flexural stress at yield, 77 Shore D
• ✓ Tuned for the XiP LSPc profile — fine detail and repeatable accuracy, first time
• ✓ 1.5 kg bottle · also in 5 kg · ships in 1–2 business days

xMOLD is Nexa3D’s dissolvable resin for Freeform Injection Molding — print the mould on an LSPc printer, inject a real production thermoplastic, then dissolve the mould away in solvent. Injection-moulded parts without cutting steel tooling.

• ✓ Tooling in hours, not weeks — revise the mould in CAD and reprint the same day
• ✓ Compatible with thousands of commercial injection materials, including reinforced grades
• ✓ Fully dissolvable — undercuts and internal features release without side actions
• ✓ Genuine Nexa3D · 5 kg · in stock — ships within 5–7 business days

Open-platform alternative: Cubic Ink Mold 400 VP — water-breakable Freeform Injection Molding resin, in stock. Print parameters for XiP available. View Mold 400 VP →

Halogen-free flame-retardant engineering resin — UL 94 V-0 at 2 mm with very high heat resistance, developed with BASF Forward AM.

• ✓ UL 94 V-0 at 2 mm (V-1 at 1.5 mm); rail DIN EN 45545-2 HL1/HL2; LOI ≥ 28
• ✓ Stiff and hot: 88 Shore D, HDT up to 250 °C @ 0.45 MPa (with 150 °C post-cure)
• ✓ 1.5 kg cartridge for Nexa3D XiP / XiP Pro (LSPc)