In stock
- Sealed, lot-traceable resin — a factory-sealed container with its Nexa3D batch.
- Pre-heat & thermal-bake steps — the cycle that unlocks 230°C heat deflection.
Nexa3D xPEEK147 resin 5kg-NA
xPEEK147 is a high-temperature LSPc photopolymer in the performance range of PEEK — very high stiffness, 80 MPa tensile strength and heat deflection up to 230°C after a thermal post-cure.
- ✓ Heat deflection up to 230°C (0.45 MPa) after the 170°C bake
- ✓ PEEK-range stiffness — 3220 MPa modulus, Shore D 94
- ✓ 5 kg container for NXE 400 / 400Pro (405 nm LSPc)
- ✓ In stock — ships in 1–2 business days from US inventory
$1,660
What your process engineer actually checks
The 230°C number depends on the bake
xPEEK147 only reaches heat deflection up to 230°C after a 3-hour 170°C thermal post-cure. On a UV-only cure you get 114°C at 1.82 MPa. We say that plainly and supply the full cycle, so nobody qualifies a part against a number their process cannot produce.
A materials engineer on the line
Pre-heat handling, exposure tuning, the thermal bake and finishing — answered by engineers who print Nexa3D LSPc in-house. Sub-4h reply, NDA standard.
Nexa3D xPEEK147 is a high-temperature LSPc photopolymer in the performance range of PEEK — very high stiffness, 80 MPa tensile strength and, after a thermal post-cure, heat deflection up to 230°C. Built for production parts, rapid tooling and molding. Supplied in a 5 kg container for the NXE 400 / 400Pro.
Why engineers choose xPEEK147
The LSPc resin for parts that have to stay stiff when everything gets hot.
Heat deflection up to 230°C
With the 3-hour 170°C thermal post-cure, HDT at 0.45 MPa reaches up to 230°C. On a UV-only cure you get 114°C at 1.82 MPa — the bake is what unlocks the top of the range.
PEEK-range stiffness
3220 MPa tensile modulus, 3553 MPa flexural modulus and Shore D 94 — among the stiffest photopolymers you can run on an LSPc platform.
Fast tooling and molds
Stiff and heat-stable enough for rapid molds and molding tooling, including low-pressure and blow-molding applications — printed in hours, not machined in weeks.
Electrically insulating
Volume resistivity 3.6×10¹⁶ Ω·cm and 29 kV/mm electric strength, with low 0.24% water absorption — useful where heat and insulation meet.
How we supply it
Lot-sealed resin plus the pre-heat and thermal-cure steps this material actually needs.
Pre-heat before you print
xPEEK147 needs 60°C for 24 h in its container before use, and must never exceed 65°C. We flag this on every order — skipping it is the usual cause of failed first builds.
Validated NXE 400 profile
The resin ships with Nexa3D’s validated LSPc profile; our engineers add exposure and orientation guidance for stiff, thick-section parts.
Wash, cure, then bake
xClean (max 2 min) then IPA (max 5 min). UV post-cure, then 3 h at 170°C if you need the full 230°C heat deflection.
Typical applications
Where heat, stiffness and dimensional stability have to hold together.
Physical & mechanical properties
| Property | Method | Value |
|---|---|---|
| Tensile modulus | ASTM D638 | 3220 MPa |
| Ultimate tensile strength | ASTM D638 | 80 MPa |
| Elongation at break | ASTM D638 | 3.2% |
| Flexural modulus | ASTM D790 | 3553 MPa |
| Flexural stress | ASTM D790 | 127 MPa |
| Notched Izod impact | ASTM D256 | 14.6 J/m |
| Shore D hardness | ASTM D2240 | 94 |
| HDT @ 1.82 MPa (UV cure) | ASTM D648 | 114°C |
| HDT @ 0.45 MPa (after 170°C bake) | ASTM D648 | up to 230°C |
| Water absorption (24 h) | ASTM D570 | 0.24% |
| Viscosity @ 25°C | ASTM D7867 | 1900–2300 cP |
| Density (liquid / solid) | ASTM D1475 / D792 | 1.07 / 1.26 g/cm³ |
| Electric strength | ASTM D149 | 29 kV/mm |
Values from the manufacturer’s xPEEK147 technical data sheet (2024 rev.). Mechanical figures vary with the post-cure route chosen — the values above reflect the standard xCURE cycle, with the thermal-bake route giving the highest heat deflection. Older datasheet revisions in circulation quote slightly different numbers; ask us for the current sheet before qualifying a part.
Not sure xPEEK147 is the right resin?
Compare it against the tougher and lower-cost resins in the same LSPc family.
Why source xPEEK147 through Additive Plus
- We run LSPc daily. Print profiles, pre-heat handling, exposure tuning and the 170°C bake cycle from a team that prints these resins in-house.
- US inventory, real support. Ships from US stock; volume orders and official POs handled by a materials engineer, not a form.
- Full workflow under one roof. Resin, wash and cure stations, spares and application support — one partner for the whole LSPc line.
- <24h engineer response · NDA standard.
| Brand | Nexa3D |
| Available colors | Black |
| Weight | 5 kg |
| Country of origin | USA |
| Printing Materials | Resins |
| Platform | NX |
| Technology | LSPc, DLP, XiP |
| Resin Type | High-temp |
| Application | Engineering, Manufacturing |
Product videos
Order the LSPc Resin Sample Kit for 12 printed Nexa3D material samples, or send us your STL and we'll print a paid benchmark part in xPEEK147.
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· Contact for lead timeCommon questions
Don't see yours? Email [email protected] — NDA standard, typical reply within 4 hours.
What temperature can xPEEK147 parts actually withstand?
Does the 147 in xPEEK147 mean a heat deflection of 147°C?
Which Nexa3D printers is xPEEK147 compatible with?
Does xPEEK147 need to be pre-heated before printing?
How stiff and how brittle is xPEEK147?
Is xPEEK147 certified for flammability or biocompatibility?
Can I use xPEEK147 for injection molding tooling?
Place your order, or talk to an engineer first
Order Nexa3D xPEEK147 resin 5kg-NA direct, or talk to materials engineer