Mutual NDA standard before any file review. Talk to an engineer →
Materials, DLP 3D Printing Materials, Engineering, Manufacturing, Resin 3D Printing Materials · LSPc, DLP, XiP

Nexa3D xPEEK147-Black Resin 1.5 kg for XiP

xPEEK147 Black brings PEEK-range stiffness and high-temperature performance to the Nexa3D XiP and XiP Pro — supplied in a 1.5 kg smart cartridge, with heat deflection up to 230°C after a thermal post-cure.

  • ✓ Heat deflection up to 230°C (0.45 MPa) after the 170°C bake
  • ✓ PEEK-range stiffness — 3220 MPa modulus, Shore D 94
  • ✓ 1.5 kg smart cartridge for XiP / XiP Pro (405 nm LSPc)
  • ✓ Currently on backorder — lead time confirmed before you commit

$513

Prices follow supplier cost and stock availability and are updated regularly. The price you see is today's price — once you order, it's held for 7 days.
NDA standard On backorder — we confirm the current lead time before you commit. The 5 kg format is in stock if you need material sooner.
60+AM teams supplied
Batch-to-batchconsistent viscosity & cure
Profiles + datasheetin every order
Fast dispatchL.A. stock · M–F
What your process engineer actually checks

What your process engineer actually checks

The 230°C number depends on the bake

xPEEK147 only reaches heat deflection up to 230°C after a 3-hour 170°C thermal post-cure. On a UV-only cure you get 114°C at 1.82 MPa. We say that plainly and supply the full cycle, so nobody qualifies a part against a number their process cannot produce.

A materials engineer on the line

Pre-heat handling, exposure tuning, the thermal bake and current availability — answered by engineers who print Nexa3D LSPc in-house. Sub-4h reply, NDA standard.

up to 230°C
HDT @0.45 MPa (after bake)
80 MPa
Tensile strength
Shore D 94
Hardness
XiP / XiP Pro
Compatible printers
1.5 kg
Smart cartridge
About this product

Nexa3D xPEEK147 Black in the 1.5 kg smart cartridge brings PEEK-range stiffness and high-temperature performance to the XiP and XiP Pro desktop printers — 80 MPa tensile strength, Shore D 94 and, after a thermal post-cure, heat deflection up to 230°C.

Why engineers choose xPEEK147

The LSPc resin for parts that have to stay stiff when everything gets hot.

Heat deflection up to 230°C

With the 3-hour 170°C thermal post-cure, HDT at 0.45 MPa reaches up to 230°C. On a UV-only cure you get 114°C at 1.82 MPa — the bake is what unlocks the top of the range.

PEEK-range stiffness

3220 MPa tensile modulus, 3553 MPa flexural modulus and Shore D 94 — among the stiffest photopolymers you can run on a desktop LSPc printer.

Drop-in smart cartridge

The 1.5 kg cartridge loads straight into the XiP or XiP Pro — the printer reads the material and pulls the right settings. No decanting, no manual vat fill.

Electrically insulating

Volume resistivity 3.6×10¹⁶ Ω·cm and 29 kV/mm electric strength, with low 0.24% water absorption — useful where heat and insulation meet.

Nexa3D xPEEK147 printed mold - high-temperature LSPc resin tooling part
Mold halves printed in xPEEK147 — the stiffness and post-bake heat resistance are what make printed tooling viable.

How we supply it

Lot-sealed cartridge plus the pre-heat and thermal-cure steps this material actually needs.

Step 01
Pre-heat before you print

xPEEK147 needs 60°C for 24 h before use and must never exceed 65°C. We flag this on every order — skipping it is the usual cause of failed first builds.

Step 02
Validated XiP profile

The cartridge carries Nexa3D’s validated LSPc profile; our engineers add exposure and orientation guidance for stiff, thick-section parts.

Step 03
Wash, cure, then bake

xClean (max 2 min) then IPA (max 5 min). UV post-cure in XiP Cure, then 3 h at 170°C if you need the full 230°C heat deflection.

Typical applications

Where heat, stiffness and dimensional stability have to hold together.

Rapid tooling
Molds & molding inserts
High-heat parts
Sustained elevated temperature
Electrical parts
Insulating housings
Production parts
Stiff functional end-use
Under-hood style parts
Automotive & industrial
High-temp prototypes
Thermal validation

Physical & mechanical properties

Property Method Value
Tensile modulus ASTM D638 3220 MPa
Ultimate tensile strength ASTM D638 80 MPa
Elongation at break ASTM D638 3.2%
Flexural modulus ASTM D790 3553 MPa
Flexural stress ASTM D790 127 MPa
Notched Izod impact ASTM D256 14.6 J/m
Shore D hardness ASTM D2240 94
HDT @ 1.82 MPa (UV cure) ASTM D648 114°C
HDT @ 0.45 MPa (after 170°C bake) ASTM D648 up to 230°C
Water absorption (24 h) ASTM D570 0.24%
Viscosity @ 25°C ASTM D7867 1900–2300 cP
Electric strength ASTM D149 29 kV/mm

Values from the manufacturer’s xPEEK147 technical data sheet (2024 rev.) — identical to the 5 kg NXE format. Mechanical figures vary with the post-cure route; the values above reflect the standard cycle, with the thermal bake giving the highest heat deflection.

Printer compatibility

  • XiP — 7.7 × 4.5 × 8.3 in / 195 × 115 × 210 mm build volume, 405 nm LSPc.
  • XiP Pro — 11.5 × 6.4 × 16.1 in / 292 × 163 × 410 mm build volume, 405 nm LSPc.
  • For the NXE 400 / 400Pro, order xPEEK147 in the 5 kg container instead.
Tell our materials engineer the peak temperature, load and dwell time your part sees — we’ll confirm whether xPEEK147 plus the thermal bake gets you there, and give you the current lead time for this cartridge. Sub-4h reply, NDA standard.

Why source xPEEK147 through Additive Plus

  • We run LSPc daily. Print profiles, pre-heat handling, exposure tuning and the 170°C bake cycle from a team that prints these resins in-house.
  • Honest lead times. This cartridge is currently on backorder — we confirm the real date before you commit, and flag the 5 kg format if you need material sooner.
  • Full workflow under one roof. Resin, wash and cure stations, spares and application support — one partner for the whole LSPc line.
  • <24h engineer response · NDA standard.
Brand Nexa3D
Available colors Black
Weight 1.5 kg
Country of origin USA
Printing Materials Resins
Platform XiP, XIP PRO
Technology LSPc, DLP, XiP
Resin Type High-temp
Application Engineering, Manufacturing

Product videos

Need xPEEK147 sooner?

The 5 kg container format for the NXE 400 series is stocked. Tell us your printer and timeline and we'll confirm what we can ship this week.

Common questions

Don't see yours? Email [email protected] — NDA standard, typical reply within 4 hours.

What temperature can xPEEK147 parts actually withstand?
Heat deflection reaches up to 230°C at 0.45 MPa, but only after the full post-cure route that includes a 3-hour thermal bake at 170°C. With a UV-only post-cure in XiP Cure, expect 114°C at 1.82 MPa. Choose your post-cure based on the service temperature you actually need, and tell us the peak temperature and dwell time so we can confirm the right cycle.
Does the 147 in xPEEK147 mean a heat deflection of 147°C?
No published Nexa3D document states that the 147 refers to a heat deflection temperature, and no HDT value for xPEEK147 equals 147°C. The published figures are 114°C at 1.82 MPa on a UV cure and up to 230°C at 0.45 MPa after the thermal bake. Treat 147 as part of the product name, not as a specification.
Which Nexa3D printers does the 1.5 kg xPEEK147 cartridge fit?
The 1.5 kg smart cartridge is formatted for the Nexa3D XiP (7.7 x 4.5 x 8.3 in / 195 x 115 x 210 mm build volume) and XiP Pro (11.5 x 6.4 x 16.1 in / 292 x 163 x 410 mm), both 405 nm LSPc printers. The cartridge is chip-tracked, so the printer identifies the material and loads the right profile. For the NXE 400 or 400Pro, order xPEEK147 in the 5 kg container instead.
This cartridge shows as on backorder — when can I get it?
The 1.5 kg xPEEK147 cartridge is currently on backorder rather than shipping from shelf stock. We confirm the real lead time with you before you commit to an order rather than quoting a date we cannot hold. If you need xPEEK147 sooner, the 5 kg container format for the NXE 400 series is stocked — contact us and we will tell you what is available today.
Does xPEEK147 need to be pre-heated before printing?
Yes. Nexa3D specifies pre-heating at 60°C for 24 hours before use, and never exceeding 65°C. Use pre-heated resin within about two weeks. If crystals have formed during cold storage, the same 60°C for 24 hours followed by shaking will redisperse them. Skipping the pre-heat is the most common cause of a failed first build with this material.
How stiff and how brittle is xPEEK147?
xPEEK147 is very stiff — 3220 MPa tensile modulus, 3553 MPa flexural modulus, Shore D 94 — with 80 MPa tensile strength. The trade-off is low ductility: elongation at break is about 3.2% and notched Izod impact is 14.6 J/m. It is the right choice for rigid, hot, dimensionally stable parts and the wrong choice for anything that must flex or take impact, where xPP405 is the better material.
Is xPEEK147 certified for flammability or biocompatibility?
No. The xPEEK147 datasheet publishes no UL flammability rating, no biocompatibility testing and no aerospace certification. It documents heat ageing (ASTM D3045), UV ageing (ASTM D4329) and chemical resistance (ASTM D543) as test protocols, which are not certifications. Do not specify xPEEK147 against a certification requirement without your own qualification.

Place your order, or talk to an engineer first

Order Nexa3D xPEEK147-Black Resin 1.5 kg for XiP direct, or talk to materials engineer

Add to cart