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Materials, DLP 3D Printing Materials, Engineering, Manufacturing, Resin 3D Printing Materials · LSPc

Nexa3D xMODEL35-Black Resin – Rigid High-Temp Model Photopolymer | 5 kg

Nexa3D xMODEL35-Black is a rigid 405 nm LSPc photopolymer built for functional models — 2300 MPa flexural modulus, 83 Shore D and 87 °C HDT at 1.82 MPa, so parts hold their shape under load and warmth.

  • ✓ Stiff and heat-resistant — UL94 HB rated, 112 °C glass transition
  • ✓ Runs on Nexa3D XiP, XiP Pro and NXE 400 / NXE 400 Pro — 405 nm LSPc
  • ✓ In US stock — ships in 2 business days, lot-matched for repeatable prints

$653

Prices follow supplier cost and stock availability and are updated regularly. The price you see is today's price — once you order, it's held for 7 days.
NDA standard Ships in 1–2 business days
87 °C HDT @1.82 MPa
2300 MPa Flexural modulus
<24h Engineer reply
2 days US dispatch
What your process engineer actually checks

What your process engineer actually checks

Stiffness and heat resistance you can load

xMODEL35 holds 2300 MPa flexural modulus and 87 °C HDT at 1.82 MPa, with a 112 °C glass transition and a UL94 HB rating. That is the difference between a model you look at and a functional part you can clamp, fixture and leave in a warm shop without it creeping.

A materials engineer on the line

Questions on cure settings, finishing or switching from another resin? Our engineers run Nexa3D LSPc resins in-house. Sub-4h reply, NDA standard.

405 nm LSPc
Technology
53 MPa
Tensile strength
83 D
Shore hardness
87 °C
HDT @1.82 MPa
About this product

Nexa3D xMODEL35-Black is a rigid, high-performance LSPc photopolymer for functional models, jigs and short-run end-use parts, supplied in 5 kg bottles for 405 nm Nexa3D printers. It combines 2300 MPa flexural modulus with an 87 °C HDT at 1.82 MPa, so parts hold shape under clamping load and warmth instead of creeping like a plain concept-model resin.

Nexa3D xMODEL35 Black rigid resin – 5 kg bottle for LSPc 3D printing
Nexa3D xMODEL35-Black — 5 kg bottle of 405 nm LSPc model resin.

Why engineers choose xMODEL35-Black

Stiffness and heat resistance in one model resin — the numbers a process engineer checks before committing a build.

87 °C HDT at 1.82 MPa

ASTM D648 heat deflection of 87 °C under load, 64 °C at 0.45 MPa. Parts stay dimensionally stable in warm fixtures, enclosures and under inspection lamps.

2300 MPa flexural modulus

108 MPa flexural stress and 1765 MPa tensile modulus keep thin walls, ribs and long arms from deflecting when a jig is clamped down.

UL94 HB at 1.5 mm

Rated HB at 1.5 mm wall thickness, so enclosure mock-ups and electrical fixtures can be reviewed against a documented flammability class.

53 MPa tensile, 83 D hardness

9% elongation at break and 21 J/m notched IZOD give threads, snap fits and clip features enough toughness to survive repeated handling.

How we supply xMODEL35-Black

Genuine Nexa3D resin, lot-matched and shipped from US stock.

Step 01
Formulated & tested

Nexa3D formulates xMODEL35 for 405 nm LSPc and publishes ASTM-tested mechanical, thermal and viscosity data with every batch release.

Step 02
Stocked & lot-matched

We hold 5 kg bottles in US stock and can lot-match repeat orders so a qualified build stays qualified across refills.

Step 03
Print, wash & cure

You get the validated exposure profile plus the wash and post-cure routine, so the first build lands on the published properties.

Physical and mechanical properties

Property Method Value
Young’s modulus ASTM D638 1765 MPa
Ultimate tensile strength ASTM D638 53 MPa
Elongation at break ASTM D638 9%
Viscosity, 25 °C ASTM D7867 950 cP
Viscosity, 30 °C ASTM D7867 630 cP
Flexural modulus ASTM D790 2300 MPa
Flexural stress ASTM D790 108 MPa
IZOD impact (notched / unnotched) ASTM D256 21 / 112 J/m
HDT @ 0.45 MPa ASTM D648 64 °C
HDT @ 1.82 MPa ASTM D648 87 °C
Glass transition (DMA tan δ) ASTM D4065 112 °C
Shore hardness ASTM D2240 83 D
Water absorption (24 h) ASTM D570 0.42%
Flammability UL94 HB (1.5 mm)
Liquid density ASTM D4052 1.11 g/cm³

Printed properties depend on part geometry, orientation and post-cure. Values are typical, not a specification.

Typical applications

Where the stiffness and heat numbers actually pay off.

Jigs and fixtures
Clamped tooling that must not deflect
Functional prototypes
Fit, form and load testing before tooling
Enclosures and housings
UL94 HB mock-ups for electronics reviews
Short-run end-use parts
Brackets, covers and low-volume components
Design and appearance models
Black finish that sands and paints cleanly
Assembly aids and gauges
Locators and go/no-go checks on the line

Compatible printers & post-processing

xMODEL35-Black runs on Nexa3D LSPc platforms at 405 nm: XiP, XiP Pro, NXE 400 and NXE 400 Pro. After the build, wash parts in xClean for up to 2 minutes, then finish in IPA for up to 5 minutes, and dry fully before curing. Post-cure two 30-minute cycles in the XiP Cure, or a single 60-minute cycle in the xCURE. Full cure is what delivers the published stiffness and heat deflection numbers — under-cured parts read soft and lose HDT.

Tell us your printer, target detail and finishing route — a materials engineer will confirm whether xMODEL35-Black is the right call, send the validated exposure and cure profile, and price the volume you actually need. Sub-4h reply, NDA standard.

Why source xMODEL35-Black through Additive Plus

  • Genuine Nexa3D xMODEL35-Black — lot-matched, US stock, ships in 2 business days.
  • Validated LSPc exposure and cure profiles for XiP, XiP Pro, NXE 400 and NXE 400 Pro.
  • Materials engineers who run these resins in-house — sub-4h reply, NDA standard.
  • Volume pricing and official purchase orders supported for production accounts.

Downloads

Brand Nexa3D
Available colors Black
Weight 5 kg
Country of origin USA
Printing Materials Resins
Technology LSPc
Package 5 kg bottle
Material form Liquid photopolymer resin
Printer NXE 400, NXE 400 Pro, XiP, XiP Pro
Tensile Strength 53 MPa
Tensile Modulus (MPa) 1765 MPa
Elongation at Break (%) 9%
Shore Hardness (3s) 83 D
[email protected] MPA (°C) 64 °C
Water Absorption (24hr) % 0.42%
Flexural Modulus (MPa) 2300 MPa
Flexural Strength (MPA) 108 MPa
IZOD Impact (Notched, J/m) 21 J/m
Resin Type General, High-temp, Rigid
Application Engineering, Manufacturing

Product videos

Need a color or volume we don't list?

We stock the full Nexa3D LSPc resin line and support official purchase orders and volume pricing. Tell us your printer and monthly volume and we'll match the right resin and quantity.

Common questions

Don't see yours? Email [email protected] — NDA standard, typical reply within 4 hours.

Which Nexa3D printers is xMODEL35 compatible with?
xMODEL35 is a 405 nm LSPc photopolymer that runs on Nexa3D XiP and XiP Pro desktops and NXE 400 / NXE 400 Pro systems. This 5 kg bottle suits the NXE 400 family and XiP Pro; the same resin also ships as a 1.5 kg cartridge for the XiP. Additive Plus supplies the validated exposure and cure profile for each machine, so xMODEL35 prints to a known recipe rather than a trial-and-error setup.
How is xMODEL35 different from xMODEL15?
xMODEL35 is the rigid, heat-resistant step up. It reaches 2300 MPa flexural modulus, 83 Shore D and 87 °C HDT at 1.82 MPa, against roughly 1800 MPa modulus and a far lower heat deflection point for xMODEL15. Choose xMODEL15 when you want the cheapest high-detail concept or appearance model, and xMODEL35 when the part has to carry load, get clamped or sit in a warm environment without deforming.
How do I post-process xMODEL35 parts?
Wash xMODEL35 parts in xClean for up to two minutes, then IPA for up to five minutes, dry them, and UV post-cure. The published recipe is two 30-minute cycles in the XiP Cure or one 60-minute cycle in the xCURE. Post-cure is what develops the full 53 MPa tensile strength, 83 Shore D hardness and 87 °C heat deflection — an under-cured part will read soft. The Technical Data Sheet in Downloads carries the full cure table.
Is xMODEL35-Black biocompatible or medically certified?
No. Nexa3D's ISO 10993 cytotoxicity, irritation and sensitisation testing for the xMODEL35 platform covers the non-dyed grade only, and this is the dyed Black version — it is not supplied as a biocompatible grade and should not be used for patient-contact applications. For biocompatible work use xMED412, which is capable of meeting ISO 10993-5, -10 and -23 when processed in a validated workflow. A materials engineer can confirm the right grade for your application.
What temperature can xMODEL35 parts withstand?
xMODEL35 has a heat deflection temperature of 87 °C at 1.82 MPa and 64 °C at 0.45 MPa, with a glass transition around 112 °C measured by DMA. In practice that means fixtures and functional models hold their shape in a warm shop or near moderate heat sources, well beyond what a standard concept-model resin tolerates. It is not a high-temperature engineering polymer — for sustained heat above its glass transition, talk to a materials engineer about alternatives.
How should I store xMODEL35 resin?
Keep xMODEL35 sealed in its original bottle, away from direct light and heat, at room temperature. Mix it thoroughly before pouring into the vat, and filter any reclaimed resin back into the bottle to catch cured fragments from failed prints. Stored sealed and handled this way, xMODEL35 holds its printing behaviour and mechanical properties through its stated shelf life.
Can I test xMODEL35 before ordering in volume?
Yes. Request the Nexa3D LSPc resin sample kit and print xMODEL35 on your own machine and workflow before committing to a 5 kg bottle. Additive Plus stocks xMODEL35 in the US and ships in two business days, and supports official purchase orders and volume pricing for production accounts. A materials engineer can also review your part geometry and recommend orientation and cure settings.

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