Engineering Materials for 3D Printing

Showing 105–112 of 167 Engineering

Nexa3D · LSPc, DLP, XiP

xPRO410 is a rigid, general-purpose LSPc photopolymer built on Henkel Loctite® PRO410 chemistry — extreme accuracy and an exceptional surface finish, optimized for the Nexa3D NXE 400 at up to 8 L/hour.

✓ Rigid general-purpose resin — 41 MPa tensile, Shore D 79
✓ Dimensional accuracy within 0.2% after xCURE post-cure
✓ 5 kg container for NXE 400 / 400Pro (405 nm LSPc)
✓ In stock — ships in 1–2 business days from US inventory

From $427

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In stock

· In stock — ships in 1–2 business days from US inventory.

3DCeram · CERAMIC SLA

Silicon Nitride 3D Printing Paste

Print silicon nitride (Si₃N₄) parts on 3DCeram's Ceramaker laser-SLA platform, then debind and sinter to one of the hardest, most thermal-shock-resistant ceramics.

✓ 881 MPa 4-point bending strength at >97% density, 11 Weibull modulus
✓ Thermal-shock resistant with low wettability against molten metal
✓ Ceramic SLA paste for the 3DCeram Ceramaker platform — quote-based, mutual NDA before spec review

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In stock

· In stock — ships in 1–2 business days. Custom ceramic formulations and larger batches: 2–4 weeks, configured to order.

3DCeram · CERAMIC SLA

Silicore 3D Printing Paste

Print robust, leachable Silicore foundry cores on 3DCeram's Ceramaker laser-SLA platform for complex, demanding castings.

✓ Higher-strength silica core formulation — survives handling and assembly
✓ Good leachability and low shrinkage (0.20% max to 1500 °C); all alloys except cobalt
✓ Ceramic SLA paste for the 3DCeram Ceramaker platform — quote-based, mutual NDA before spec review

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In stock

· In stock — ships in 1–2 business days. Custom ceramic formulations and larger batches: 2–4 weeks, configured to order.

Sygnis · DIW

Sygnis Ceramic Paste for Direct Ink Writing (DIW) – Al₂O₃, ZrO₂, SiC & YSZ | Heat-Resistant Insulating Parts

Direct Ink Writing–ready ceramic pastes for robust, thermally stable, electrically insulating parts — from alumina to zirconia and silicon carbide.

Alumina (Al₂O₃), YSZ, zirconia (ZrO₂), silicon carbide (SiC), aluminosilicate and titania (TiO₂)
Formulated for DIW / paste extrusion — heat-resistant, high-strength, insulating components
Proven across automotive, medical, chemical and food-industry applications

Priced and supplied per configuration — composition, pack size and lead time confirmed at quote. NDA standard.

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On backorder

· Supplied per configuration — pack size and lead time confirmed at quote.

Sygnis · DIW

Sygnis Silicone for Direct Ink Writing (DIW) — Printable Silicone Ink | 20–80 Shore A

Printable liquid silicone for Direct Ink Writing (DIW) — low viscosity for clean extrusion and low-temperature curing, in a tunable 20–80 Shore A hardness range for flexible, durable printed parts.

✓ 20–80 Shore A · service range −50 °C to 200 °C
✓ Low viscosity, low-temperature cure · bonds to metal, glass, ceramic, plastic
✓ For DIW / paste-extrusion printing · priced per configuration

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In stock

· Priced and shipped per configuration — hardness grade, pack size and lead time confirmed at quote.

3DCeram · CERAMIC SLA

Tricalcium Phosphate 3D Printing Paste

Print bioresorbable tricalcium phosphate (TCP) scaffolds on 3DCeram's Ceramaker laser-SLA platform, then debind and sinter to a clean, resorbable bioceramic.

✓ Bioresorbable — gradually replaced by natural bone; Ca/P ratio 1.503, no calcium pyrophosphate
✓ Print porous, patient-specific scaffolds for bone regeneration and spinal implants
✓ Ceramic SLA paste for the 3DCeram Ceramaker platform — quote-based, mutual NDA before spec review

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In stock

· In stock — ships in 1–2 business days. Custom ceramic formulations and larger batches: 2–4 weeks, configured to order.

Nexa3D · LSPc, DLP, XiP

Nexa3D x45 Natural Tough Prototyping Resin – LSPc Production Supply | 220 kg Drum

x45 Natural is BASF Forward AM's tough general-purpose photopolymer for Nexa3D LSPc printers, supplied as a 220 kg production drum — 52 MPa tensile, 12% elongation and build speeds above 15 cm/hr, sized for high-throughput XiP Pro and NXE fleets.

✓ Production-scale supply: one traceable 220 kg lot feeds a whole printer fleet
✓ Tough general-purpose resin: 52 MPa tensile, 12% elongation, Shore 85 D
✓ Ultrafast on XiP Pro and NXE — over 15 cm/hr with validated NexaX profiles
✓ Made-to-order drum — lead time confirmed at quote

From $31331

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On backorder

· Made-to-order production drum — lead time confirmed at quote. Contact us to schedule supply to your production cadence.

Nexa3D · LSPc, DLP, XiP

Nexa3D x45 Clear Tough Prototyping Resin – LSPc for XiP | 1 kg

x45 Clear is BASF Forward AM's tough photopolymer for Nexa3D LSPc printers — 52 MPa tensile strength, 12% elongation and good out-of-printer clarity, at vertical build speeds above 15 cm/hr.

✓ Tough general-purpose resin: 52 MPa tensile, 12% elongation, Shore 85 D
✓ Ultrafast on XiP, XiP Pro and NXE — over 15 cm/hr with validated NexaX profiles
✓ Genuine Nexa3D · 1 kg Clear cartridge · lot-traceable
✓ In-stock grades ship in 1–2 business days from US inventory

From $153

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Out of stock

· Temporarily out of stock — request current lead time and volume availability. In-stock x45 grades ship in 1–2 business days from US inventory.

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