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Materials, DLP 3D Printing Materials, Engineering, Manufacturing, Resin 3D Printing Materials · LSPc, DLP

Nexa3D xPRO1100 Black Rigid Engineering Resin for XiP – High Heat Resistance | 1.5 kg

Rigid high-temperature polyurethane engineering resin for the Nexa3D XiP family — parts that behave like injection-moulded thermoplastic.

  • ✓ 71 MPa tensile, ~3000 MPa modulus, 84 Shore D — stiff and dimensionally stable
  • ✓ HDT up to 112 °C and 141 °C Tg; steam-sterilizable at 134 °C
  • ✓ 1.5 kg bottle for XiP / XiP Pro / NXE 400Pro · ships in 1–2 business days

$240

Prices follow supplier cost and stock availability and are updated regularly. The price you see is today's price — once you order, it's held for 7 days.
NDA standard Ships in 1–2 business days
71 MPa Tensile strength
112 °C HDT at 0.45 MPa
84 Shore D Hardness
141 °C Glass transition

What your process engineer actually checks

Stiffness and heat in one material

71 MPa tensile strength with a Young's modulus near 3000 MPa and 84 Shore D, combined with heat deflection up to 112 °C and a 141 °C glass transition. Most rigid resins give you one or the other — xPRO1100 holds both, which is why it stands in for injection-moulded engineering thermoplastic.

The bake is part of the spec

UV post-cure alone leaves heat deflection at roughly 61 °C at 1.82 MPa. Adding the optional 2-hour thermal treatment at 100 °C lifts it to 93 °C. If your part sees heat, that step is not optional — we supply the full schedule so your results match the data sheet.

A materials engineer on the line

Send us the service temperature and load case and we will tell you whether xPRO1100 clears it or whether you need the flame-retardant or higher-HDT grade. Sub-4h reply, NDA standard.

About this product

Nexa3D xPRO1100 Black is a rigid, high-temperature polyurethane engineering resin — the Nexa3D-branded version of BASF Forward AM’s Ultracur3D RG 1100 B. It prints stiff, dimensionally stable parts that behave like injection-moulded thermoplastic: 71 MPa tensile strength, 84 Shore D, and heat deflection up to 112 °C once thermally post-cured.

Nexa3D xPRO1100 Black rigid engineering resin 1.5 kg bottle for XiP and XiP Pro LSPc printers
xPRO1100 Black — 1.5 kg bottle for the Nexa3D XiP family.

Why engineers choose xPRO1100 Black

The engineering grade in the Nexa3D range — stiff, hot and stable, for parts that have to work.

Injection-moulding-like stiffness

71 MPa ultimate tensile strength, ~3000 MPa Young’s modulus and 125 MPa flexural stress — parts behave like moulded engineering thermoplastic, not like a prototype resin.

Real heat resistance

Heat deflection up to 112 °C at 0.45 MPa and a 141 °C glass transition. An optional 2-hour bake at 100 °C is what unlocks the top of that range.

Stable and sterilizable

Water absorption of just 0.14 % over 24 hours, and the material passes ISO 10993-5 cytotoxicity and survives steam sterilization at 134 °C.

Low viscosity, easy running

280 cP at 25 °C — one of the easier engineering resins to pour, level and clean down between material changes on the XiP.

How you run it

The thermal post-cure is optional — but it is the difference between 69 °C and 93 °C heat deflection.

Step 01
Print

Run xPRO1100 Black on the Nexa3D XiP, XiP Pro or NXE 400Pro. Shake well, pour, and let the surface go bubble-free before starting the build.

Step 02
Wash

Wash in xClean, then IPA — no more than 2 minutes in xClean and 5 minutes in IPA, so edges and fine features stay sharp.

Step 03
UV cure, then bake

UV post-cure to reach spec. Then optionally ramp to 100 °C, hold 2 hours and cool — this raises heat deflection at 1.82 MPa from about 61 °C to 93 °C.

Technical specifications

Property Value Method
Ultimate tensile strength 71–72 MPa ASTM D638
Young’s modulus 2940–3010 MPa ASTM D638
Elongation at break 4.0–4.7 % ASTM D638
Flexural stress 125 MPa ASTM D790
Flexural modulus 2790 MPa ASTM D790
HDT at 0.45 MPa 97–112 °C ASTM D648
HDT at 1.82 MPa 69–93 °C ASTM D648
Glass transition (Tg) 141 °C ASTM D4065 (DMA)
Izod impact (notched) 21 J/m ASTM D256
Charpy impact (notched) 1.11 kJ/m² ISO 179-1
Hardness 84 Shore D ASTM D2240
Water absorption (24 h) 0.14 % ASTM D570
Flammability HB at 1.5 mm UL 94
Viscosity 280 cP at 25 °C · 190 cP at 30 °C ASTM D7867
Density (liquid / solid) 1.11 / 1.2 g/cm³ —

Figures from the Nexa3D xPRO1100-Black technical data sheet (2024 v5), measured on UV-cured specimens with the additional 2-hour thermal treatment at 100 °C. Ranges reflect the different post-processing routes given in the data sheet.

Typical applications

Parts that need stiffness, heat tolerance and dimensional stability together.

Automotive components
Housings, brackets, connectors
Aerospace prototypes
Stiff, dimensionally stable parts
Durable jigs & fixtures
Where PRO9499 runs too hot
Printed tooling & moulds
PU foam and prototype mould inserts
Sterilizable fixtures
Steam autoclave at 134 °C
End-use engineering parts
Short-run functional production

Not sure xPRO1100 is the right grade?

The XiP platform runs a full ladder of resins — pick on duty cycle and budget, not on colour.

Tell us the service temperature and the load your part has to carry — a materials engineer will confirm whether xPRO1100 clears it, and whether you need the thermal post-cure. Sub-4h reply, NDA standard.

Why source xPRO1100 through Additive Plus

  • Genuine Nexa3D-supplied xPRO1100 Black — the BASF Forward AM Ultracur3D RG 1100 B formulation — with the matching LSPc profile.
  • Materials engineers who run these resins in-house and can advise on the thermal post-cure schedule.
  • US inventory, ships in 1–2 business days; volume and purchase-order pricing on request.
  • The whole XiP chain in one place: resin, printer, post-processing and spares.
Brand Nexa3D
Weight 1.5 kg
Printing Materials Resins
Platform XiP
Technology LSPc, DLP
Resin Type High-temp, Rigid
Application Engineering, Manufacturing
Test it at your service temperature

Send us an STL and the temperature your part has to survive. We will print it in xPRO1100 on a Nexa3D XiP in California, run the full thermal post-cure, and ship you the part to test on your own bench.

Common questions

Don't see yours? Email [email protected] — NDA standard, typical reply within 4 hours.

What is xPRO1100 Black actually for — is it an injection-molding resin?
xPRO1100 Black is a rigid, high-temperature engineering resin for functional prototypes and end-use engineering parts — not a resin for moulding or a sacrificial tooling material. The confusion is understandable: Nexa3D describes it as matching the mechanical properties of injection-moulding plastics, which means finished parts behave like moulded thermoplastic. It is not used to prototype the moulding process itself. There is a legitimate tooling angle: BASF has published work using this rigid polyurethane to 3D print durable moulds and prototype inserts that withstand real closing forces. If you want a dissolvable mould for Freeform Injection Moulding, that is Nexa3D xMOLD, a different product.
Which Nexa3D printers is xPRO1100 Black compatible with?
xPRO1100 Black runs on the Nexa3D LSPc platform: the XiP and XiP Pro desktop and industrial systems, and the NXE 400Pro. BASF's own printed-mould case study was run on the XiP Pro. At 280 cP at 25 °C it is one of the easier engineering resins to pour, level and clean out between material changes, which matters if you swap grades on a single machine. Layer thickness is not fixed by the resin — it follows the printer profile you select. We supply the matching LSPc material profile with the resin so you are not tuning exposure from scratch.
What post-processing does xPRO1100 need, and is the thermal bake necessary?
Wash printed parts in xClean and then IPA, keeping to roughly 2 minutes and 5 minutes respectively so detail is not softened. Then UV post-cure. After that comes the step that matters most for this resin: an optional thermal treatment where you ramp to 100 °C, hold for 2 hours and cool. That bake is what lifts heat deflection at 1.82 MPa from about 61 °C on UV cure alone to 93 °C, and pushes HDT at 0.45 MPa toward 112 °C. If your part will see any real service temperature, treat the bake as mandatory rather than optional.
How hot can xPRO1100 parts actually run in service?
Fully post-processed, xPRO1100 Black reaches a heat deflection temperature of 97–112 °C at 0.45 MPa and 69–93 °C at the more demanding 1.82 MPa load, with a glass transition of 141 °C measured by DMA. The practical read: it comfortably handles under-hood-adjacent warmth, hot fixtures and steam sterilization at 134 °C, but a continuously loaded part sitting above about 90 °C is outside its comfortable range. Note that marketing pages sometimes quote a rounded HDT of 116 °C — the data sheet values above are the ones to design against.
How does xPRO1100 compare with PRO9499 White and xPRO9400-FR?
xPRO1100 Black is the engineering grade: 71 MPa tensile against PRO9499's 40 MPa, roughly double the heat resistance, and 84 Shore D against 77. PRO9499 White is the value general-purpose resin for models, concept parts and everyday prototypes where cost per litre matters more than performance. xPRO9400-FR is the specialist — halogen-free flame retardant, UL 94 V-0 at 2 mm, for rail and electronics enclosures with a burn-behaviour requirement. All three run on the same XiP platform, so you can move up or down the ladder without changing machine or workflow.
Is xPRO1100 biocompatible or sterilizable?
xPRO1100 Black passes ISO 10993-5 cytotoxicity testing and withstands steam sterilization at 134 °C, which makes it a practical choice for reusable lab and clinical fixtures, jigs and holders that must go through an autoclave. That is not the same as a medical device clearance. Passing a cytotoxicity screen does not mean the material is cleared for patient-contact or implantable use, and Additive Plus does not market it for those applications. If you are considering xPRO1100 for anything touching a patient, contact us first and we will get the current regulatory position from Nexa3D in writing.
How should xPRO1100 be stored and handled?
Store xPRO1100 Black in its closed original bottle, out of daylight and UV, at normal workshop temperature. Shake the bottle well before pouring and wait for the vat surface to become bubble-free before starting a build — trapped air is the most common cause of surface defects with this resin. Handle liquid photopolymer with gloves and eye protection, and always cure waste resin before disposal rather than pouring it away. The bottle supplied here is 1.5 kg, sized for the XiP and XiP Pro; ask us if you need to standardise several machines on this grade.

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