Made to order
- Validated cure profile + datasheet for the printers we sell
- Mutual NDA before any file or spec review
ALTANA Cubic Ink HP 4-2800 VP-ESD – ESD Resin for Final Parts (DLP/LCD/mSLA)
Low-viscosity ESD resin with real toughness for final-part production — dissipative volume resistivity (5.5 × 10⁷ Ω·cm) plus 65 MPa strength and HDT-B 94 °C.
- ✓ ESD-dissipative — volume resistivity 5.5 × 10⁷ Ω·cm for static-safe parts
- ✓ Tough & strong — 65 MPa tensile, 2700 MPa modulus, 86 Shore D
- ✓ HDT-B 94 °C, excellent chemical resistance; easy low-viscosity processing
- ✓ A similar option to Loctite IND3380 ESD
What your process engineer actually checks
ESD behaviour we can validate
The 5.5 x 10^7 Ω·cm volume resistivity, 65 MPa tensile and HDT-B 94 °C come straight from the ALTANA TDS. We help set post-cure so parts reach stable ESD behaviour and full strength.
A materials engineer on the line
Factory-trained support. We help you choose between HP 4-2800 ESD, the higher-temp HT 303 VP ESD and the Loctite IND3380 ESD we also stock. Sub-24h reply, NDA standard.
ALTANA Cubic Ink High Performance 4-2800 VP-ESD Black is a low-viscosity ESD resin with real toughness for final-part production — dissipative volume resistivity of 5.5 × 107 Ω·cm, plus 65 MPa strength and HDT-B 94 °C.
ESD parts in the field
Static-dissipative components 3D-printed in HP 4-2800 VP-ESD.
Why engineers choose HP 4-2800 VP-ESD
Static-safe parts that are also tough.
ESD-dissipative
Volume resistivity 5.5 × 107 Ω·cm keeps parts in the static-dissipative range for electronics handling and assembly.
Tough final parts
65 MPa tensile strength, 2700 MPa modulus, 86 Shore D and 17 J/m Izod for durable end-use parts.
Heat & chemical resistant
HDT-B 94 °C and under ~2% mass gain across acids, bases and common solvents.
Easy, low-viscosity processing
Just 110 mPa·s for clean, fast printing on LCD, DLP and mSLA systems.
Technical properties
Measured on black resin (TDS v6, 13 Mar 2026). Washed with water; UV + thermal post-cure.
| Property | Value | Method |
|---|---|---|
| Viscosity (25 °C) | 110 mPa·s | DIN EN ISO 3219 |
| Density | 1.09 g/mL | DIN EN ISO 15212-1 |
| Ultimate tensile strength | 65 MPa | DIN EN ISO 527-5A |
| Tensile modulus | 2700 MPa | DIN EN ISO 527-5A |
| Elongation at break | 4.0 % | DIN EN ISO 527-5A |
| Izod, notched | 17 J/m | DIN EN ISO 180 |
| Shore hardness | 86 D | DIN EN ISO 7619 |
| Tg (DSC) | 107 °C | DSC |
| HDT-B | 94 °C | DIN EN ISO 75 |
| Volume resistivity | 5.5 × 107 Ω·cm | IEC 60093 |
| Comparative tracking index | > 600 V | IEC 60112 |
| Color | Black | — |
A similar option to Loctite IND3380 ESD
Same ESD final-part class. Additive Plus supplies and supports both.
| Property | Loctite IND3380 ESD | Cubic Ink HP 4-2800 VP-ESD |
|---|---|---|
| Ultimate tensile strength | 50 MPa | 65 MPa |
| Tensile modulus | 3000 MPa | 2700 MPa |
| Elongation at break | 2 % | 4.0 % |
| Notched Izod | 13 J/m | 17 J/m |
| HDT (0.45 MPa) | 190 °C | 94 °C |
| Shore hardness | 86 D | 86 D |
| Price (1 kg) | $360 | $449 |
HP 4-2800 ESD is tougher (higher tensile, elongation and impact); IND3380 offers higher heat resistance (HDT 190 °C). For higher-temperature ESD, ask about Cubic Ink HT 303 VP ESD. Additive Plus supplies and supports both.
Typical applications
Static-safe electronics parts.
How you run it
Print → wash → UV + thermal post-cure.
LCD / DLP / mSLA. Low 110 mPa·s viscosity; stir before use.
Wash
Wash with water or Cubic Ink Cleaner 400; dry.
Post-cure
UV plus thermal post-cure to reach full properties and stable ESD behaviour.
| Size | 1 kg, 5 kg |
| Brand | ALTANA Cubic Ink |
We formulate and qualify. Custom variants on request.
Need a tuned resin, a filled or castable formulation, or a profile for a printer we don't list yet? Our materials team qualifies custom formulations and prints test specimens before you commit. Typical lead 2–4 weeks.
Complete the workflow
The Axtra3D Revox X1 is a production-grade 4K DLP resin 3D printer — the same chassis and TruLayer separation as the flagship Lumia X1, at an entry price point for teams that can work within DLP part quality on a 9.8×5.5×19.5 in / 249×140×495 mm build volume.
- ✔ Production 4K DLP at 405 nm — 65 µm XY resolution
- ✔ TruLayer separation runs large cross-sections and filled, viscous resins
- ✔ Open or closed 405 nm material configurations
- ✔ Lead time: configured to order — request a quote for delivery & installation
Desktop automated station that removes dissolvable support material from FDM and PolyJet 3D-printed parts in a heated, agitated water-detergent bath — no IPA, no hand-picking.
- ✓ Automated heated soluble-support removal (50–85 °C) for FDM & PolyJet
- ✓ 46 L tank · 10×10×12 in basket · quiet desktop footprint
- ✓ US-built · CE / cTÜVus · 1-year warranty · quote for pricing
Other products teams run alongside ALTANA Cubic Ink HP 4-2800 VP-ESD – ESD Resin for Final Parts (DLP/LCD/mSLA)
Rigid high-temperature polyurethane engineering resin for the Nexa3D XiP family — parts that behave like injection-moulded thermoplastic.
- ✓ 71 MPa tensile, ~3000 MPa modulus, 84 Shore D — stiff and dimensionally stable
- ✓ HDT up to 112 °C and 141 °C Tg; steam-sterilizable at 134 °C
- ✓ 1.5 kg bottle for XiP / XiP Pro / NXE 400Pro · ships in 1–2 business days
In stock
· 1–2 Business Days
The genuine Nexa3D Everlast-2 membrane keeps your XiP producing clean, consistent parts — print after print.
- ✔ Rated 50,000+ layers (~20 L per membrane) — up to 25× the life of standard films
- ✔ Genuine Nexa3D OEM — second-generation interface for sharp feature definition
- ✔ Ships from our Los Angeles warehouse in 5–15 business days
Order a spare today — a worn membrane shouldn’t cost you a print day.
In stock
· 5–15 Business Days
Made to order
· Contact for lead time
- ✔ Specialty technical ceramic produced on an everyday FFF machine
- ✔ Print → debind → sinter to dense ceramic, no powder system required
- ✔ Genuine Zetamix by Nanoe · 500 g spool · lead time 10–20 business days (depending on order queue)
In stock
· Ships in 1–2 business days
Currently not in stock. Leave a request and we will confirm availability, price and lead time.
Washing solvent for rinsing uncured resin off SLA and LSPc 3D-printed parts — holds around 3× the dissolved resin of IPA and has a higher flash point, so it is safer to handle and lasts longer between changes.
- ✓ ~3× the resin capacity of IPA — fewer changeouts, less waste
- ✓ Higher flash point than IPA · leaves no greasy residue · water-rinse after
- ✓ 5 L · US-made · available on request (not in stock)
Out of stock
· Not in stock — available on request
CNPC Inconel 625 powder for LPBF — made by CNPC Powder, 15–53 µm, sold in 10 kg containers.
- Certificate of analysis (COA) for the lot, on request
Manufacturer: CNPC Powder
Made to order
· Ship date confirmed after you order
Precise, flexible resin for orthodontic indirect bonding trays — now for the XiP.
- ✓ Sets brackets accurately, then flexes for easy, non-stick release
- ✓ Biocompatible resin purpose-built for IBT workflows
- ✓ 1 kg cartridge for Nexa3D XiP and XiP Pro (LSPc)
In stock
· 2 Business Days
KS608A is a tough, heat- and moisture-resistant UV SLA resin for accurate, durable parts — ABS-like finish, low shrinkage and low yellowing, with a validated cure profile in every order. Supplied in a 10 kg (22 lb) container.
- ✓ Tough, ABS-like mechanicals — 25–30 MPa tensile, 58–70 J/m notched Izod, 12–20% elongation
- ✓ Heat & moisture resistant — HDT 58–68°C, Tg 55–70°C for warm functional testing
- ✓ Runs on any 405 nm SLA (desktop or large-format) with the included cure profile
- ✓ In US stock · ships from Los Angeles in 1–2 business days · datasheet included
In stock
· 1-2 Business DaysCommon questions
Don't see yours? Email [email protected] — NDA standard, typical reply within 4 hours.
What is HP 4-2800 VP-ESD for?
What are its ESD properties?
How does it compare to Loctite IND3380 ESD?
What color is it and is it heat-resistant?
How is it processed and how fast does it ship?
Place your order, or talk to an engineer first
Order ALTANA Cubic Ink HP 4-2800 VP-ESD – ESD Resin for Final Parts (DLP/LCD/mSLA) direct, or talk to materials engineer