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Application

171 products From $ 17 made in USA

Showing 97–104 of 171 Application

Nexa3D xMODEL17-Clear High-Clarity Resin for XiP | 1.5 kg
Nexa3D · LSPc, DLP, XiP
Nexa3D xMODEL17-Clear High-Clarity Resin for XiP | 1.5 kg

xMODEL17-Clear is a high-clarity prototyping resin from Nexa3D — fine feature detail and transparency at very high print speed.

  • ✓ High optical clarity for see-through models, fluidics, and light-transmitting prototypes
  • ✓ Fine feature resolution with fast throughput on the Nexa3D XiP
  • ✓ Genuine Nexa3D resin for the XiP · 1.5 kg · ships from US stock in 2 business days
From $208
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In stock

· 2 Business Days
Nexa3D xMODEL17-Clear High-Clarity Prototyping Resin | 5 kg
Nexa3D · LSPc, DLP, XiP
Nexa3D xMODEL17-Clear High-Clarity Prototyping Resin | 5 kg

xMODEL17-Clear is a high-clarity prototyping resin from Nexa3D — fine feature detail and transparency at very high print speed.

  • ✓ High optical clarity for see-through models, fluidics, and light-transmitting prototypes
  • ✓ Fine feature resolution with fast throughput on Nexa3D systems
  • ✓ Genuine Nexa3D resin for NXE-series printers · 5 kg · ships from US stock in 2 business days
From $646
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In stock

· 2 Business Days
Nexa3D xMODEL35-Black Resin – Rigid High-Temp Photopolymer for XiP | 1.5 kg
Nexa3D · LSPc
Nexa3D xMODEL35-Black Resin – Rigid High-Temp Photopolymer for XiP | 1.5 kg
Rigid. Heat-resistant. Stiff under load. Genuine Nexa3D xMODEL35-Black LSPc photopolymer in a 1.5 kg cartridge for XiP and XiP Pro — 1765 MPa Young's modulus, 2300 MPa flexural modulus, 87 °C HDT at 1.82 MPa, 83 D Shore hardness and UL94 HB at 1.5 mm. For functional models, jigs and light end-use parts that have to hold shape when things get warm.
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In stock

· 2 Business Days
Nexa3D xMODEL35-Black Resin – Rigid High-Temp Model Photopolymer | 5 kg
Nexa3D · LSPc
Nexa3D xMODEL35-Black Resin – Rigid High-Temp Model Photopolymer | 5 kg

Nexa3D xMODEL35-Black is a rigid 405 nm LSPc photopolymer built for functional models — 2300 MPa flexural modulus, 83 Shore D and 87 °C HDT at 1.82 MPa, so parts hold their shape under load and warmth.

  • ✓ Stiff and heat-resistant — UL94 HB rated, 112 °C glass transition
  • ✓ Runs on Nexa3D XiP, XiP Pro and NXE 400 / NXE 400 Pro — 405 nm LSPc
  • ✓ In US stock — ships in 2 business days, lot-matched for repeatable prints
From $652
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In stock

· 2 Business Days
Nexa3D xMODEL35-Gray Resin – Rigid High-Temp Photopolymer for XiP | 1.5 kg
Nexa3D · LSPc
Nexa3D xMODEL35-Gray Resin – Rigid High-Temp Photopolymer for XiP | 1.5 kg
Rigid. Stiff. Heat-tolerant. Genuine Nexa3D xMODEL35-Gray LSPc photopolymer in a 1.5 kg cartridge for the XiP and XiP Pro — 87 °C HDT at 1.82 MPa, 2300 MPa flexural modulus, 53 MPa tensile strength and UL94 HB at 1.5 mm. The step up from xMODEL15 when a printed part has to hold its shape under load and warmth, with a gray surface that reads detail cleanly for engineering review.
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In stock

· 2 Business Days
Nexa3D xMODEL35-Gray Resin – Rigid High-Temp Model Photopolymer | 5 kg
Nexa3D · LSPc
Nexa3D xMODEL35-Gray Resin – Rigid High-Temp Model Photopolymer | 5 kg
Rigid. Stiff. Heat-tolerant. Genuine Nexa3D xMODEL35-Gray LSPc resin in the 5 kg bottle — 87 °C HDT at 1.82 MPa, 2300 MPa flexural modulus and a UL94 HB rating at 1.5 mm, for functional models, jigs and short-run end-use parts on XiP, XiP Pro and NXE 400 printers.
From $652
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In stock

· 2 Business Days
Nexa3D xPEEK147 resin 5kg-NA
Nexa3D · LSPc, DLP, XiP
Nexa3D xPEEK147 resin 5kg-NA

xPEEK147 is a high-temperature LSPc photopolymer in the performance range of PEEK — very high stiffness, 80 MPa tensile strength and heat deflection up to 230°C after a thermal post-cure.

  • ✓ Heat deflection up to 230°C (0.45 MPa) after the 170°C bake
  • ✓ PEEK-range stiffness — 3220 MPa modulus, Shore D 94
  • ✓ 5 kg container for NXE 400 / 400Pro (405 nm LSPc)
  • ✓ In stock — ships in 1–2 business days from US inventory
From $1660
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In stock

· In stock — ships in 1–2 business days from US inventory.
Nexa3D xPEEK147-Black Resin 1.5 kg for XiP
Nexa3D · LSPc, DLP, XiP
Nexa3D xPEEK147-Black Resin 1.5 kg for XiP

xPEEK147 Black brings PEEK-range stiffness and high-temperature performance to the Nexa3D XiP and XiP Pro — supplied in a 1.5 kg smart cartridge, with heat deflection up to 230°C after a thermal post-cure.

  • ✓ Heat deflection up to 230°C (0.45 MPa) after the 170°C bake
  • ✓ PEEK-range stiffness — 3220 MPa modulus, Shore D 94
  • ✓ 1.5 kg smart cartridge for XiP / XiP Pro (405 nm LSPc)
  • ✓ Currently on backorder — lead time confirmed before you commit
From $512
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On backorder

· On backorder — we confirm the current lead time before you commit. The 5 kg format is in stock if you need material sooner.

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